Metallization in AIN substrate through electroless Cu technique
碩士 === 國立清華大學 === 材料科學工程研究所 === 75 ===
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1992
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ndltd-TW-075NTHU21590392016-02-12T04:10:37Z http://ndltd.ncl.edu.tw/handle/57102714652728638838 Metallization in AIN substrate through electroless Cu technique 利用無電鍍銅技術在氮化鋁基板進行金屬化處理 張建豪 碩士 國立清華大學 材料科學工程研究所 75 ZHANG, SHI-GIN 杜正恭 1992 學位論文 ; thesis 0 zh-TW |
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NDLTD |
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zh-TW |
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Others
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description |
碩士 === 國立清華大學 === 材料科學工程研究所 === 75 ===
|
author2 |
ZHANG, SHI-GIN |
author_facet |
ZHANG, SHI-GIN 張建豪 |
author |
張建豪 |
spellingShingle |
張建豪 Metallization in AIN substrate through electroless Cu technique |
author_sort |
張建豪 |
title |
Metallization in AIN substrate through electroless Cu technique |
title_short |
Metallization in AIN substrate through electroless Cu technique |
title_full |
Metallization in AIN substrate through electroless Cu technique |
title_fullStr |
Metallization in AIN substrate through electroless Cu technique |
title_full_unstemmed |
Metallization in AIN substrate through electroless Cu technique |
title_sort |
metallization in ain substrate through electroless cu technique |
publishDate |
1992 |
url |
http://ndltd.ncl.edu.tw/handle/57102714652728638838 |
work_keys_str_mv |
AT zhāngjiànháo metallizationinainsubstratethroughelectrolesscutechnique AT zhāngjiànháo lìyòngwúdiàndùtóngjìshùzàidànhuàlǚjībǎnjìnxíngjīnshǔhuàchùlǐ |
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1718186803400278016 |