Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
碩士 === 國立交通大學 === 電子工程研究所 === 73 ===
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1993
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95216666492312018973 |