Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads

Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads

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碩士 === 國立交通大學 === 電子工程研究所 === 73 ===

Bibliographic Details
Main Author:	鄭仁鈞
Other Authors:	WANG, DE-SHEG
Format:	Others
Language:	zh-TW
Published:	1993
Online Access:	http://ndltd.ncl.edu.tw/handle/95216666492312018973

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