Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads

Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads

Show other versions (1)

碩士 === 國立交通大學 === 電子工程研究所 === 73 ===

Bibliographic Details
Main Author: 鄭仁鈞
Other Authors: WANG, DE-SHEG
Format: Others
Language:zh-TW
Published: 1993
Online Access:http://ndltd.ncl.edu.tw/handle/95216666492312018973
id ndltd-TW-073NCTU2428007
record_format oai_dc
spelling ndltd-TW-073NCTU24280072015-10-13T11:29:05Z http://ndltd.ncl.edu.tw/handle/95216666492312018973 Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads 冷卻速率對銲錫凸塊之微硬度和接觸電阻的影響及無電鍍鎳對鋁墊打線接合的影響 鄭仁鈞 碩士 國立交通大學 電子工程研究所 73 WANG, DE-SHEG 邱碧秀 1993 學位論文 ; thesis 0 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 電子工程研究所 === 73 ===
author2 WANG, DE-SHEG
author_facet WANG, DE-SHEG
鄭仁鈞
author 鄭仁鈞
spellingShingle 鄭仁鈞
Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
author_sort 鄭仁鈞
title Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
title_short Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
title_full Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
title_fullStr Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
title_full_unstemmed Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
title_sort effects of cooling rate on microhardness and contact resistance of solder bumps and electroless ni plating on wire bonding of al pads
publishDate 1993
url http://ndltd.ncl.edu.tw/handle/95216666492312018973
work_keys_str_mv AT zhèngrénjūn effectsofcoolingrateonmicrohardnessandcontactresistanceofsolderbumpsandelectrolessniplatingonwirebondingofalpads
AT zhèngrénjūn lěngquèsùlǜduìhànxītūkuàizhīwēiyìngdùhéjiēchùdiànzǔdeyǐngxiǎngjíwúdiàndùnièduìlǚdiàndǎxiànjiēhédeyǐngxiǎng
_version_ 1716843903856934912

Similar Items