A Study of Bonding Formation in the Ultrasonic Welding of Aluminum and Copper

A Study of Bonding Formation in the Ultrasonic Welding of Aluminum and Copper

Bibliographic Details
Main Author:	Choi, Soo-Woong
Language:	English
Published:	The Ohio State University / OhioLINK 1981
Subjects:	Systems Science Engineering Metallurgy
Online Access:	http://rave.ohiolink.edu/etdc/view?acc_num=osu1391785096

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