Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles

Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles

Bibliographic Details
Main Author:	Laing, Jeffrey M.
Language:	English
Published:	Ohio University / OhioLINK 2012
Subjects:	Engineering Mechanical Engineering Finite Element Micro Channel Extrusion Hollow Profile High Extrusion Ratio Multi Billet Copper Extrusion
Online Access:	http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357

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