Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles
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2012
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Online Access: | http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357 |
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ndltd-OhioLink-oai-etd.ohiolink.edu-ohiou13273333572021-08-03T05:47:17Z Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles Laing, Jeffrey M. Engineering Mechanical Engineering Finite Element Micro Channel Extrusion Hollow Profile High Extrusion Ratio Multi Billet Copper Extrusion <p>The purpose of this research was to develop an approach to simulate a novel, high ratio extrusion process using finite element (FE) software. In order to accomplish this, several techniques were used. These include local mesh refinement, increasing the frequency of remeshing, increasing nodal relaxation and decreasing the duration of the time step. Three simulations were completed using progressively larger billets with the goal of determining the largest billet that could be extruded by a 250 kN, 400 ton or 1600 ton press.</p><p>Simulation results for the 250 kN press were compared to experimental data from lab-scale testing. The extrusion force predicted was within 2% of the experimental value. Simulations of scaled-up processes, using 400 and 1600 ton presses, were compared to results of a basic extrusion-work calculation, with an uncertainty of 12%. The results of the FE analyses were within 10% of the calculated values and within the expected uncertainty.</p> 2012-04-18 English text Ohio University / OhioLINK http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357 http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357 unrestricted This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws. |
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language |
English |
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NDLTD |
topic |
Engineering Mechanical Engineering Finite Element Micro Channel Extrusion Hollow Profile High Extrusion Ratio Multi Billet Copper Extrusion |
spellingShingle |
Engineering Mechanical Engineering Finite Element Micro Channel Extrusion Hollow Profile High Extrusion Ratio Multi Billet Copper Extrusion Laing, Jeffrey M. Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
author |
Laing, Jeffrey M. |
author_facet |
Laing, Jeffrey M. |
author_sort |
Laing, Jeffrey M. |
title |
Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
title_short |
Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
title_full |
Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
title_fullStr |
Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
title_full_unstemmed |
Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles |
title_sort |
finite element modeling and validation of a novel process for extruding thin wall hollow copper profiles |
publisher |
Ohio University / OhioLINK |
publishDate |
2012 |
url |
http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357 |
work_keys_str_mv |
AT laingjeffreym finiteelementmodelingandvalidationofanovelprocessforextrudingthinwallhollowcopperprofiles |
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1719425260446547968 |