Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics

Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics

Bibliographic Details
Main Author: Smarra, Devin A.
Language:English
Published: University of Dayton / OhioLINK 2017
Subjects:
Electrical Engineering
LTCC
Electronic Packaging
Low Temperature Co-Fired Ceramic
High Temperature Electronics
Microelectronics
Online Access:http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894
id ndltd-OhioLink-oai-etd.ohiolink.edu-dayton1493386231571894
record_format oai_dc
spelling ndltd-OhioLink-oai-etd.ohiolink.edu-dayton14933862315718942021-08-03T07:02:08Z Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics Smarra, Devin A. Electrical Engineering LTCC Electronic Packaging Low Temperature Co-Fired Ceramic High Temperature Electronics Microelectronics Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55<sup>o</sup>C to 225<sup>o</sup>C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices. 2017-05-24 English text University of Dayton / OhioLINK http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894 http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894 unrestricted This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.
collection NDLTD
language English
sources NDLTD
topic Electrical Engineering
LTCC
Electronic Packaging
Low Temperature Co-Fired Ceramic
High Temperature Electronics
Microelectronics
spellingShingle Electrical Engineering
LTCC
Electronic Packaging
Low Temperature Co-Fired Ceramic
High Temperature Electronics
Microelectronics
Smarra, Devin A.
Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
author Smarra, Devin A.
author_facet Smarra, Devin A.
author_sort Smarra, Devin A.
title Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
title_short Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
title_full Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
title_fullStr Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
title_full_unstemmed Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
title_sort low temperature co-fired ceramic (ltcc) substrate for high temperature microelectronics
publisher University of Dayton / OhioLINK
publishDate 2017
url http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894
work_keys_str_mv AT smarradevina lowtemperaturecofiredceramicltccsubstrateforhightemperaturemicroelectronics
_version_ 1719452173816823808

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