Electrochemical Atomic Layer Deposition of Metals for Applications in Semiconductor Interconnect Metallization

Electrochemical Atomic Layer Deposition of Metals for Applications in Semiconductor Interconnect Metallization

Bibliographic Details
Main Author: Venkatraman, Kailash
Language:English
Published: Case Western Reserve University School of Graduate Studies / OhioLINK 2019
Subjects:
Nanotechnology
Chemical Engineering
underpotential deposition
surface-limited redox replacement
electrochemical atomic layer deposition
diffusion-reaction modeling
electroless underpotential deposition
electroless atomic layer deposition
Online Access:http://rave.ohiolink.edu/etdc/view?acc_num=case1543839404490434

Internet

http://rave.ohiolink.edu/etdc/view?acc_num=case1543839404490434

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