CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS

Bibliographic Details
Main Author:	Sun, Di
Language:	English
Published:	Case Western Reserve University School of Graduate Studies / OhioLINK 2014
Subjects:	Electrical Engineering
Online Access:	http://rave.ohiolink.edu/etdc/view?acc_num=case1396631435

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spelling	ndltd-OhioLink-oai-etd.ohiolink.edu-case13966314352021-08-03T06:23:19Z CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS Sun, Di Electrical Engineering Modifications to a novel multi-layered polydimethylsiloxane (PDMS) encapsulation process that include improvements to the substrate cleaning procedure and roller casting application method were developed to produce a robust non-hermetic micropackage technology for chronic micro implant systems. Packaged interdigitated electrodes subjected to accelerated lifetime tests at 85°C in a saline environment had an average lifetime of 156.6 days, which exceeded the previous average lifetime by 22.3 days and suggests a packaging lifetime in the human body greater than 2 years and perhaps as long as 5 years. In order to understand the unexpectedly long lifetime, material characterization experiments were performed on PDMS films deposited by dip, spin and roller-casting. The results show that roller casting increases the mass density, decreases the vapor permeability, and increases bonding strength on FR4 PCB substrates by +2%, -14%, +19%, respectively relative to the other deposition methods. 2014-06-12 English text Case Western Reserve University School of Graduate Studies / OhioLINK http://rave.ohiolink.edu/etdc/view?acc_num=case1396631435 http://rave.ohiolink.edu/etdc/view?acc_num=case1396631435 unrestricted This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.
collection	NDLTD
language	English
sources	NDLTD
topic	Electrical Engineering
spellingShingle	Electrical Engineering Sun, Di CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
author	Sun, Di
author_facet	Sun, Di
author_sort	Sun, Di
title	CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
title_short	CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
title_full	CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
title_fullStr	CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
title_full_unstemmed	CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS
title_sort	characterization of medical grade poly-dimethylsiloxane as encapsulation materials for implantable microelectromechanical systems
publisher	Case Western Reserve University School of Graduate Studies / OhioLINK
publishDate	2014
url	http://rave.ohiolink.edu/etdc/view?acc_num=case1396631435
work_keys_str_mv	AT sundi characterizationofmedicalgradepolydimethylsiloxaneasencapsulationmaterialsforimplantablemicroelectromechanicalsystems
_version_	1719435805115547648

CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS

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