An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution
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Case Western Reserve University School of Graduate Studies / OhioLINK
2012
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| Online Access: | http://rave.ohiolink.edu/etdc/view?acc_num=case1339068900 |
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ndltd-OhioLink-oai-etd.ohiolink.edu-case13390689002021-08-03T05:34:26Z An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution Liao, Chi-Hong Chemical Engineering Electrodeposition Copper Zinc Nucleation <p>A non-cyanide copper (Cu) plating solution that can serve as an alternative to the commercial Cu-cyanide solution, is identified. The new solution is a strong alkaline electrolyte (pH¿¿¿¿¿¿¿13.5), where the Cu is complexed to a tartrate salt. It was found that the Cu-tartrate solution provides high deposition overpotential and high nucleation density, which are critical for obtaining high-quality plated layers. This alkaline complex electrolyte enables high quality Cu plating on zinc (Zn), among other, less challenging substrates.</p><p>The initial stages of the electroplating process are critical to the properties of the deposit. Pulse potentiostatic technique has been utilized to study the nucleation and growth of the Cu deposits. Current transients recorded during the nucleation experiments indicated instantaneous nucleation. The nucleation density of the Cu is estimated from the nucleation model and compared to microscopic observation. </p><p>The Cu films electroplated from the Cu-tartrate solution were studied using numerous surface characterization techniques and found to be comparable to those obtained from the Cu-cyanide solution. X-ray photoelectron spectroscopy (XPS) demonstrated that tartrate solution provides good Cu coverage on the Zn substrate and that the deposit is of high purity. Tape-peeling- and electrolytic tests indicated good adhesion of the Cu deposit to the Zn substrate. The residual stress in the Cu deposit has also been measured. The stability of the alkaline Cu-tartrate solution – an essential characteristic for a commercial process – was also studied. At lower pH values, the solution decomposed forming cuprous oxide (Cu2O) precipitates, but at higher pH (> 13), the electrolyte was stable.</p> 2012-08-27 English text Case Western Reserve University School of Graduate Studies / OhioLINK http://rave.ohiolink.edu/etdc/view?acc_num=case1339068900 http://rave.ohiolink.edu/etdc/view?acc_num=case1339068900 unrestricted This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws. |
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NDLTD |
| language |
English |
| sources |
NDLTD |
| topic |
Chemical Engineering Electrodeposition Copper Zinc Nucleation |
| spellingShingle |
Chemical Engineering Electrodeposition Copper Zinc Nucleation Liao, Chi-Hong An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| author |
Liao, Chi-Hong |
| author_facet |
Liao, Chi-Hong |
| author_sort |
Liao, Chi-Hong |
| title |
An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| title_short |
An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| title_full |
An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| title_fullStr |
An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| title_full_unstemmed |
An Environmentally Friendly Electroplating Process of Copper from an Alkaline Solution |
| title_sort |
environmentally friendly electroplating process of copper from an alkaline solution |
| publisher |
Case Western Reserve University School of Graduate Studies / OhioLINK |
| publishDate |
2012 |
| url |
http://rave.ohiolink.edu/etdc/view?acc_num=case1339068900 |
| work_keys_str_mv |
AT liaochihong anenvironmentallyfriendlyelectroplatingprocessofcopperfromanalkalinesolution AT liaochihong environmentallyfriendlyelectroplatingprocessofcopperfromanalkalinesolution |
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