Time domain characterization of interconnect discontinuities
The purpose of this study is to develop experimental techniques to characterize typical interconnect discontinuities, including bends, steps, T junctions, vias and pads, which are the most commonly encountered interconnections in high speed digital integrated circuits, hybrid and monolithic microwav...
| Main Author: | |
|---|---|
| Other Authors: | |
| Language: | en_US |
| Published: |
2013
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1957/36724 |