A high aspect-ratio silicon substrate-via technology and applications
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000. === Includes bibliographical references (p. 85-90). === Substrate vias are widely used in GaAs microwave and millimeter-wave ICs to provide low impedance ground connections. As silicon R...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/8811 |