Low temperature transient liquid phase bonding for electronic packaging

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. === Includes bibliographical references (leaf 50) === by Michelle M. Hou. === M.S.

Bibliographic Details
Main Author:	Hou, Michelle M. (Michelle Ming-Jan)
Other Authors:	Thomas W. Eagar.
Format:	Others
Language:	English
Published:	Massachusetts Institute of Technology 2011
Subjects:	Materials Science and Engineering
Online Access:	http://hdl.handle.net/1721.1/60735

id	ndltd-MIT-oai-dspace.mit.edu-1721.1-60735
record_format	oai_dc
spelling	ndltd-MIT-oai-dspace.mit.edu-1721.1-607352019-05-02T16:03:48Z Low temperature transient liquid phase bonding for electronic packaging Hou, Michelle M. (Michelle Ming-Jan) Thomas W. Eagar. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. Includes bibliographical references (leaf 50) by Michelle M. Hou. M.S. 2011-01-26T14:16:27Z 2011-01-26T14:16:27Z 1992 1992 Thesis http://hdl.handle.net/1721.1/60735 27659862 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 50 leaves application/pdf Massachusetts Institute of Technology
collection	NDLTD
language	English
format	Others
sources	NDLTD
topic	Materials Science and Engineering
spellingShingle	Materials Science and Engineering Hou, Michelle M. (Michelle Ming-Jan) Low temperature transient liquid phase bonding for electronic packaging
description	Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. === Includes bibliographical references (leaf 50) === by Michelle M. Hou. === M.S.
author2	Thomas W. Eagar.
author_facet	Thomas W. Eagar. Hou, Michelle M. (Michelle Ming-Jan)
author	Hou, Michelle M. (Michelle Ming-Jan)
author_sort	Hou, Michelle M. (Michelle Ming-Jan)
title	Low temperature transient liquid phase bonding for electronic packaging
title_short	Low temperature transient liquid phase bonding for electronic packaging
title_full	Low temperature transient liquid phase bonding for electronic packaging
title_fullStr	Low temperature transient liquid phase bonding for electronic packaging
title_full_unstemmed	Low temperature transient liquid phase bonding for electronic packaging
title_sort	low temperature transient liquid phase bonding for electronic packaging
publisher	Massachusetts Institute of Technology
publishDate	2011
url	http://hdl.handle.net/1721.1/60735
work_keys_str_mv	AT houmichellemmichellemingjan lowtemperaturetransientliquidphasebondingforelectronicpackaging
_version_	1719033959652786176

Low temperature transient liquid phase bonding for electronic packaging

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