Low temperature transient liquid phase bonding for electronic packaging

Low temperature transient liquid phase bonding for electronic packaging

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. === Includes bibliographical references (leaf 50) === by Michelle M. Hou. === M.S.

Bibliographic Details
Main Author: Hou, Michelle M. (Michelle Ming-Jan)
Other Authors: Thomas W. Eagar.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2011
Subjects:
Materials Science and Engineering
Online Access:http://hdl.handle.net/1721.1/60735
Description
Summary:Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. === Includes bibliographical references (leaf 50) === by Michelle M. Hou. === M.S.

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