Thermodynamic modeling of solder melting and solidification for proposed squishbot design

Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009. === Cataloged from PDF version of thesis. === Includes bibliographical references (p. 52). === This thesis develops a thermodynamic simulation of the melting and solidification of a substance resting on a su...

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Bibliographic Details
Main Author: Utz, Robert (Robert C.)
Other Authors: Martin Culpepper.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2010
Subjects:
Online Access:http://hdl.handle.net/1721.1/54485