Physical understanding and modeling of chemical mechanical planarization in dielectric materials

Physical understanding and modeling of chemical mechanical planarization in dielectric materials

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Physics, 2007. === Includes bibliographical references (p. 257-268). === Chemical mechanical planarization (CMP) has become the enabling planarization technique of choice for current and emerging silicon integrated circuit (IC) fabrica...

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Bibliographic Details
Main Author: Xie, Xiaolin, Ph. D. Massachusetts Institute of Technology
Other Authors: Duane Boning and David Litster.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2009
Subjects:
Physics.
Online Access:http://hdl.handle.net/1721.1/45403

Internet

http://hdl.handle.net/1721.1/45403

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