Wettability of low Sn solders on integrated circuit package metallizations

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983. === MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE === Includes bibliographical references. === by Michelle Wendy Gabriel. === M.S.

Bibliographic Details
Main Author:	Gabriel, Michelle Wendy
Other Authors:	Nicholas J. Grant.
Format:	Others
Language:	English
Published:	Massachusetts Institute of Technology 2008
Subjects:	Materials Science and Engineering.
Online Access:	http://hdl.handle.net/1721.1/42094

id	ndltd-MIT-oai-dspace.mit.edu-1721.1-42094
record_format	oai_dc
spelling	ndltd-MIT-oai-dspace.mit.edu-1721.1-420942019-05-02T16:14:38Z Wettability of low Sn solders on integrated circuit package metallizations Gabriel, Michelle Wendy Nicholas J. Grant. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Materials Science and Engineering. Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983. MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE Includes bibliographical references. by Michelle Wendy Gabriel. M.S. 2008-09-03T14:34:40Z 2008-09-03T14:34:40Z 1983 1983 Thesis http://hdl.handle.net/1721.1/42094 10959189 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 73 leaves application/pdf Massachusetts Institute of Technology
collection	NDLTD
language	English
format	Others
sources	NDLTD
topic	Materials Science and Engineering.
spellingShingle	Materials Science and Engineering. Gabriel, Michelle Wendy Wettability of low Sn solders on integrated circuit package metallizations
description	Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983. === MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE === Includes bibliographical references. === by Michelle Wendy Gabriel. === M.S.
author2	Nicholas J. Grant.
author_facet	Nicholas J. Grant. Gabriel, Michelle Wendy
author	Gabriel, Michelle Wendy
author_sort	Gabriel, Michelle Wendy
title	Wettability of low Sn solders on integrated circuit package metallizations
title_short	Wettability of low Sn solders on integrated circuit package metallizations
title_full	Wettability of low Sn solders on integrated circuit package metallizations
title_fullStr	Wettability of low Sn solders on integrated circuit package metallizations
title_full_unstemmed	Wettability of low Sn solders on integrated circuit package metallizations
title_sort	wettability of low sn solders on integrated circuit package metallizations
publisher	Massachusetts Institute of Technology
publishDate	2008
url	http://hdl.handle.net/1721.1/42094
work_keys_str_mv	AT gabrielmichellewendy wettabilityoflowsnsoldersonintegratedcircuitpackagemetallizations
_version_	1719036903356891136

Wettability of low Sn solders on integrated circuit package metallizations

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