Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 81-84). === This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabricatio...

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Main Author: Arora, William Jay
Other Authors: George Barbastathis and Henry I. Smith.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2006
Subjects:
Online Access:http://hdl.handle.net/1721.1/33107
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spelling ndltd-MIT-oai-dspace.mit.edu-1721.1-331072019-05-02T15:37:07Z Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges Folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges Arora, William Jay George Barbastathis and Henry I. Smith. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. Includes bibliographical references (p. 81-84). This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes. by William Jay Arora. M.Eng. 2006-06-19T17:41:09Z 2006-06-19T17:41:09Z 2005 2005 Thesis http://hdl.handle.net/1721.1/33107 62221878 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 84 p. 4876777 bytes 4880756 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
collection NDLTD
language English
format Others
sources NDLTD
topic Electrical Engineering and Computer Science.
spellingShingle Electrical Engineering and Computer Science.
Arora, William Jay
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
description Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 81-84). === This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes. === by William Jay Arora. === M.Eng.
author2 George Barbastathis and Henry I. Smith.
author_facet George Barbastathis and Henry I. Smith.
Arora, William Jay
author Arora, William Jay
author_sort Arora, William Jay
title Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
title_short Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
title_full Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
title_fullStr Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
title_full_unstemmed Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
title_sort nanostructured origami (tm) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
publisher Massachusetts Institute of Technology
publishDate 2006
url http://hdl.handle.net/1721.1/33107
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