Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 81-84). === This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabricatio...
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ndltd-MIT-oai-dspace.mit.edu-1721.1-331072019-05-02T15:37:07Z Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges Folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges Arora, William Jay George Barbastathis and Henry I. Smith. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. Includes bibliographical references (p. 81-84). This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes. by William Jay Arora. M.Eng. 2006-06-19T17:41:09Z 2006-06-19T17:41:09Z 2005 2005 Thesis http://hdl.handle.net/1721.1/33107 62221878 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 84 p. 4876777 bytes 4880756 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
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Electrical Engineering and Computer Science. |
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Electrical Engineering and Computer Science. Arora, William Jay Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 81-84). === This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes. === by William Jay Arora. === M.Eng. |
author2 |
George Barbastathis and Henry I. Smith. |
author_facet |
George Barbastathis and Henry I. Smith. Arora, William Jay |
author |
Arora, William Jay |
author_sort |
Arora, William Jay |
title |
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
title_short |
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
title_full |
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
title_fullStr |
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
title_full_unstemmed |
Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
title_sort |
nanostructured origami (tm) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges |
publisher |
Massachusetts Institute of Technology |
publishDate |
2006 |
url |
http://hdl.handle.net/1721.1/33107 |
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