Optoelectronic integration using the magnetically assisted statistical assembly technique : initial magnetic characterization and process development
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2002. === Includes bibliographical references (p. 99-101). === The commercial integration of optoelectronic devices heavily relies on hybrid techniques such as wire bonding and flip-chip bondi...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1721.1/32714 |