A liquid-shear-stress sensor using wafer-bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990. === Includes bibliographical references (leaves 131-135). === by Kay-Yip Ng. === M.S.
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/13434 |