Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. === Includes bibliographical references (p. 207-209). === by Gregory J. Smith. === M.S.

Bibliographic Details
Main Author: Smith, Gregory J. (Gregory John)
Other Authors: Lionel C. Kimerling and Steven D. Eppinger.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2005
Subjects:
Sloan School of Management
Electrical Engineering and Computer Science
Online Access:http://hdl.handle.net/1721.1/12393

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