Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. === Includes bibliographical references (p. 207-209). === by Gregory J. Smith. === M.S.

Bibliographic Details
Main Author:	Smith, Gregory J. (Gregory John)
Other Authors:	Lionel C. Kimerling and Steven D. Eppinger.
Format:	Others
Language:	English
Published:	Massachusetts Institute of Technology 2005
Subjects:	Sloan School of Management Electrical Engineering and Computer Science
Online Access:	http://hdl.handle.net/1721.1/12393

id	ndltd-MIT-oai-dspace.mit.edu-1721.1-12393
record_format	oai_dc
spelling	ndltd-MIT-oai-dspace.mit.edu-1721.1-123932019-05-02T16:27:25Z Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications Smith, Gregory J. (Gregory John) Lionel C. Kimerling and Steven D. Eppinger. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science Sloan School of Management Sloan School of Management Electrical Engineering and Computer Science Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. Includes bibliographical references (p. 207-209). by Gregory J. Smith. M.S. 2005-08-15T23:17:47Z 2005-08-15T23:17:47Z 1993 1993 Thesis http://hdl.handle.net/1721.1/12393 29329792 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 209 p. 14325829 bytes 14325588 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
collection	NDLTD
language	English
format	Others
sources	NDLTD
topic	Sloan School of Management Electrical Engineering and Computer Science
spellingShingle	Sloan School of Management Electrical Engineering and Computer Science Smith, Gregory J. (Gregory John) Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
description	Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. === Includes bibliographical references (p. 207-209). === by Gregory J. Smith. === M.S.
author2	Lionel C. Kimerling and Steven D. Eppinger.
author_facet	Lionel C. Kimerling and Steven D. Eppinger. Smith, Gregory J. (Gregory John)
author	Smith, Gregory J. (Gregory John)
author_sort	Smith, Gregory J. (Gregory John)
title	Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
title_short	Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
title_full	Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
title_fullStr	Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
title_full_unstemmed	Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
title_sort	managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
publisher	Massachusetts Institute of Technology
publishDate	2005
url	http://hdl.handle.net/1721.1/12393
work_keys_str_mv	AT smithgregoryjgregoryjohn managingprocessdevelopmentriskaluminumultrasonicwirebondingforchiponboardapplications
_version_	1719040707429138432

Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

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