Thermomechanical effects in electronic packages
Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994. === Includes bibliographical references (leaves 160-164). === by Georgios Margaritis. === Sc.D.
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ndltd-MIT-oai-dspace.mit.edu-1721.1-122502019-05-02T16:25:07Z Thermomechanical effects in electronic packages Margaritis, Georgios Frederick J. McGarry. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994. Includes bibliographical references (leaves 160-164). by Georgios Margaritis. Sc.D. 2005-08-16T20:01:22Z 2005-08-16T20:01:22Z 1994 1994 Thesis http://hdl.handle.net/1721.1/12250 30756249 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 165 leaves 9323898 bytes 9323653 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
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English |
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Others
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Materials Science and Engineering |
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Materials Science and Engineering Margaritis, Georgios Thermomechanical effects in electronic packages |
description |
Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994. === Includes bibliographical references (leaves 160-164). === by Georgios Margaritis. === Sc.D. |
author2 |
Frederick J. McGarry. |
author_facet |
Frederick J. McGarry. Margaritis, Georgios |
author |
Margaritis, Georgios |
author_sort |
Margaritis, Georgios |
title |
Thermomechanical effects in electronic packages |
title_short |
Thermomechanical effects in electronic packages |
title_full |
Thermomechanical effects in electronic packages |
title_fullStr |
Thermomechanical effects in electronic packages |
title_full_unstemmed |
Thermomechanical effects in electronic packages |
title_sort |
thermomechanical effects in electronic packages |
publisher |
Massachusetts Institute of Technology |
publishDate |
2005 |
url |
http://hdl.handle.net/1721.1/12250 |
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AT margaritisgeorgios thermomechanicaleffectsinelectronicpackages |
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