Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. === Cataloged from PDF version of thesis. === Includes bibliographical references (pages 45-49). === The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While...
Main Author: | Kornbluth, Yosef S |
---|---|
Other Authors: | Luis Fernando Velásuez-García |
Format: | Others |
Language: | English |
Published: |
Massachusetts Institute of Technology
2018
|
Subjects: | |
Online Access: | http://hdl.handle.net/1721.1/118707 |
Similar Items
-
Modeling of impression testing to obtain mechanical properties of lead-free solders microelectronic interconnects
by: How, Yew Seng.
Published: (2012) -
Thermal conduction in microelectronic circuits
by: Goodson, Kenneth E. (Kenneth Eugene)
Published: (2005) -
Electroplated Compliant High-Density Interconnects For Next-Generation Microelectronic Packaging
by: Lo, George Chih-Yu
Published: (2005) -
Computer simulation of electromigration in microelectronics interconnect
by: Zhu, Xiaoxin
Published: (2014) -
Numerical Simulation Of A Microchannel For Microelectronic Cooling
by: Wong, Wai Hing, et al.
Published: (2007)