Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. === Cataloged from PDF version of thesis. === Includes bibliographical references (pages 45-49). === The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While...
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ndltd-MIT-oai-dspace.mit.edu-1721.1-1187072019-05-02T16:21:15Z Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects Kornbluth, Yosef S Luis Fernando Velásuez-García Massachusetts Institute of Technology. Department of Mechanical Engineering. Massachusetts Institute of Technology. Department of Mechanical Engineering. Mechanical Engineering. Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. Cataloged from PDF version of thesis. Includes bibliographical references (pages 45-49). The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal. by Yosef S. Kornbluth. S.M. 2018-10-22T18:45:48Z 2018-10-22T18:45:48Z 2018 2018 Thesis http://hdl.handle.net/1721.1/118707 1056978006 eng MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission. http://dspace.mit.edu/handle/1721.1/7582 49 pages application/pdf Massachusetts Institute of Technology |
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Mechanical Engineering. |
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Mechanical Engineering. Kornbluth, Yosef S Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
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Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. === Cataloged from PDF version of thesis. === Includes bibliographical references (pages 45-49). === The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal. === by Yosef S. Kornbluth. === S.M. |
author2 |
Luis Fernando Velásuez-García |
author_facet |
Luis Fernando Velásuez-García Kornbluth, Yosef S |
author |
Kornbluth, Yosef S |
author_sort |
Kornbluth, Yosef S |
title |
Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
title_short |
Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
title_full |
Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
title_fullStr |
Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
title_full_unstemmed |
Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
title_sort |
focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects |
publisher |
Massachusetts Institute of Technology |
publishDate |
2018 |
url |
http://hdl.handle.net/1721.1/118707 |
work_keys_str_mv |
AT kornbluthyosefs focusedatmosphericpressuremicrosputtererforadditivemanufacturingofmicroelectronicsinterconnects |
_version_ |
1719038737398104064 |