Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects

Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. === Cataloged from PDF version of thesis. === Includes bibliographical references (pages 45-49). === The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While...

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Bibliographic Details
Main Author: Kornbluth, Yosef S
Other Authors: Luis Fernando Velásuez-García
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2018
Subjects:
Online Access:http://hdl.handle.net/1721.1/118707
Description
Summary:Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018. === Cataloged from PDF version of thesis. === Includes bibliographical references (pages 45-49). === The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal. === by Yosef S. Kornbluth. === S.M.