Photoelectrochemical Etching of Isolated, High Aspect Ratio Microstructures in n-Type Silicon (100)
Three-dimensional integration techniques have become increasingly popular to meet the ever rising demand of high capacity and reduced package size in microelectronics devices. Through Silicon Vias (TSVs) offer an efficient method to achieve 3D packaging with shorter interconnection length and higher...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en |
| Published: |
LSU
2011
|
| Subjects: | |
| Online Access: | http://etd.lsu.edu/docs/available/etd-06112011-104922/ |