Shockwave consolidation of nano silver powder into bulk nano structured silver

Bulk nanostructured silver components were fabricated from nano-sized powder using a shockwave consolidation technique. The grain size evolution during compaction, the mechanical properties of the bulk components, and the effect of surface finish on the mechanical behavior were studied. X-Ray diffra...

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Bibliographic Details
Main Author: Zhang, Li, 1973-
Format: Others
Language:en
Published: McGill University 2007
Subjects:
Online Access:http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=100238
Description
Summary:Bulk nanostructured silver components were fabricated from nano-sized powder using a shockwave consolidation technique. The grain size evolution during compaction, the mechanical properties of the bulk components, and the effect of surface finish on the mechanical behavior were studied. X-Ray diffraction, transmission electron microscopy (TEM), atomic force microscopy (AFM), microhardness, compression testing and shear punch testing at room temperature were used to characterize the materials. Upon consolidation, the average grain size calculated from image analysis of the TEM micrographs was 49+/-22 nm, showing the feasibility of maintaining a nanostructure upon dynamic consolidation. The hardness of the bulk nanostructured components was constant across the diameter with an average of 83+/-1 HV. Compression results showed strength about 390+/-10 MPa and ductility of 23+/-2%, which is well above strength level obtainable from strain hardened Ag components. The AFM results show that samples possessing a surface roughness of 267 nm exhibited a brittle behavior and a reduction in strength of 35% when compared to the smoother surfaces. Dimples were observed for the samples exhibiting plasticity, while an intergranular pattern was identified for the brittle materials. Fracture toughness of 0.2 MPa m was calculated, which confirms the strong relationship between fracture toughness and defects observed in nanomaterials.