Mechanism of wet anisotropic etching of silicon for nano-scale applications
The fabrication processes of recent MEMS devices require the use of anisotropic etching and variety of concave structures. Analysis of these structures uncovered phenomenon in the etch rates of surfaces exposed by anisotropic etchant. This phenomenon could not be explained without consideration of...
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2007
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| Online Access: | http://spectrum.library.concordia.ca/975298/1/NR30139.pdf Stateikina, Irina <http://spectrum.library.concordia.ca/view/creators/Stateikina=3AIrina=3A=3A.html> (2007) Mechanism of wet anisotropic etching of silicon for nano-scale applications. PhD thesis, Concordia University. |