Effect of various process variables on the mechanical properties of laminates produced through resin transfer molding process

• Main Author: Jarugu, Sudheer Reddy
• Format: Others
• Published: 1996
• Online Access: http://spectrum.library.concordia.ca/199/1/MQ26009.pdf; Jarugu, Sudheer Reddy <http://spectrum.library.concordia.ca/view/creators/Jarugu=3ASudheer_Reddy=3A=3A.html> (1996) Effect of various process variables on the mechanical properties of laminates produced through resin transfer molding process. Masters thesis, Concordia University.

The increasing interest in the Resin Transfer Molding Process (RTM) evolved from its potential for reducing manufacturing costs, while increasing the capability of manufacturing complex parts. This manufacturing process like many other processes involves a large number of variables, consisting of both material and processing parameters. The present study uses statistical experimental design analysis as a tool to determine which of the various independent and controllable RTM process variables affect the mechanical properties of the laminates produced through the RTM process. The statistical experiment is conducted in two phases. In the first phase, ten independent and controllable RTM process variables are chosen for study. For the first time, a sieve design is used to eliminate variables that are of not much importance. In the second phase, the important process variables are re-experimented, and the range at which they produce a good response (Laminate) is studied. In contrast to earlier studies, the present study considers the interaction effect of all the variables. Vacuum assistance is used during the mold filling, and its interaction affect on other factors, and effect on mechanical properties is also analyzed. In line with earlier studies, three different tests (mechanical three point bending, short beam shear, and dynamic mechanical test) are conducted to examine the possibility that a single important process variable might not have the same effect on all of them.