Ag Nanoparticles and their Application in Low-Temperature Bonding of Cu
Ag nanoparticle (NP) paste was fabricated and used to bond Cu wire to Cu foil at low temperatures down to 433 K. The relatively low bonding temperature promotes this method to be used in polymer-based flexible electronics, which cannot withstand high bonding temperatures due the possible melting of...
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| Language: | en |
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2014
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| Online Access: | http://hdl.handle.net/10012/8118 |