Multi-scale thermal and circuit analysis for nanometre-scale integrated circuits
Chip temperature is increasing with continued technology scaling due to increased power density and decreased device feature sizes. Since temperature has significant impact on performance and reliability, accurate thermal and circuit analysis are of great importance. Due to the shrinking device feat...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en en |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1974/1508 |