Surface impedance formulation for electric field integral equation in magneto-quasistatic and full-wave boundary element models of interconnects
Today’s high-speed interconnects at the chip, package, and board levels of integration can be rigorously modeled with the boundary element method based on the surface discretization of the electric field integral equation (EFIE). The accuracy of such models critically depends on the surface impedanc...
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| Language: | en_US |
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2010
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| Online Access: | http://hdl.handle.net/1993/4136 |