Numerical simulation of transient liquid phase bonding under temperature gradient

Numerical simulation of transient liquid phase bonding under temperature gradient

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Transient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion dr...

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Bibliographic Details
Main Author:	Ghobadi Bigvand, Arian
Other Authors:	Ojo, Olanrewaju Akanbi (Mechanical and Manufacturing Engineering)
Published:	2013
Subjects:	Bonding Simulation Finite element method TLP TG-TLP
Online Access:	http://hdl.handle.net/1993/21969

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