Numerical simulation of transient liquid phase bonding under temperature gradient
Transient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion dr...
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2013
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| Online Access: | http://hdl.handle.net/1993/21969 |