Modeling, design, fabrication and characterization of miniaturized passives and integrated EM shields in 3D RF packages
An innovative structure for thin-film band-pass filters was proposed and analyzed. This structure was employed in the design, fabrication, and development of 3D IPD diplexers on glass substrates with double-side metallization electrically connected by through-vias. Through modeling, design, fabricat...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54369 |