Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration

Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration

In this research, wafer-level flexible input/output interconnection technologies, Mechanically Flexible Interconnects (MFIs), have been developed. First, Au-NiW MFIs with 65 µm vertical elastic range of motion are designed and fabricated. The gold passivation layer is experimentally verified to not...

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Bibliographic Details
Main Author: Zhang, Chaoqi
Other Authors: Bakir, Muhannad S.
Language:en_US
Published: Georgia Institute of Technology 2015
Subjects:
Advanced packaging
Heterogeneous system
Flexible interconnects
Rematable assembly
CMOS/MEMS integration
Spray-coating
Interposer
Online Access:http://hdl.handle.net/1853/53637

Internet

http://hdl.handle.net/1853/53637

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