Pattern collapse in lithographic nanostructures: quantifying photoresist nanostructure behavior and novel methods for collapse mitigation
The Microelectronics industry has continuously pushed the limit of critical dimensions to sub-20 nm. One of the challenges is pattern collapse, caused by unbalanced capillary forces during the final rinse and drying process. The use of surfactants offers a convenient method to reduce capillary force...
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Georgia Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1853/47696 |