Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling
Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can support the heat removal requirements for 3D integrated circuits that contain high-performance microprocessor...
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Georgia Institute of Technology
2012
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| Online Access: | http://hdl.handle.net/1853/44759 |