Materials, design and processing of air encapsulated MEMS packaging
Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS). In this work, an overcoat material is used to cover a sacrificial polymer, which protects the MEMS device during packaging. Once the overcoat is in place, the sacrificial polymer is thermally decom...
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Georgia Institute of Technology
2012
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| Online Access: | http://hdl.handle.net/1853/43751 |