Development of system level integration of compact RF components on multilayer liquid crystal polymer (LCP)
A system packaging level approach on liquid crystal polymer (LCP) was proposed for low cost, lightweight, and compact wireless communication systems. Via technology was explored for V-band W-band transitions and an active cooling system that are essential for compact multilayer integration. RF MEMS...
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Georgia Institute of Technology
2012
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| Online Access: | http://hdl.handle.net/1853/42763 |