Chip-last embedded low temperature interconnections with chip-first dimensions
Small form-factor packages with high integration density are driving the innovations in chip-to-package interconnections. Metallurgical interconnections have evolved from the conventional eutectic and lead-free solders to fine pitch copper pillars with lead-free solder cap. However, scaling down the...
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Georgia Institute of Technology
2011
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| Online Access: | http://hdl.handle.net/1853/37104 |