Adhesion mechanisms of nano-particle silver to electronics packaging materials
To reduce electronics packaging lead time and potentially to reduce manufacturing cost, an innovative packaging process targeting rapid package prototyping (RPP) has been developed. The developed RPP process, which is based on a data-driven chip-first approach, provides electrical functionality as w...
| Main Author: | |
|---|---|
| Published: |
Georgia Institute of Technology
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1853/31730 |