Fluidic driven cooling of electronic hardware Part I: channel integrated vibrating reed Part II: active heat sink

• Main Author: Gerty, Donavon R.
• Published: Georgia Institute of Technology 2010
• Subjects: Piezofan; Active heat sink; Vibrating reed; Electronics Cooling; Fluidic devices; Heat Convection; Jets Fluid dynamics
• Online Access: http://hdl.handle.net/1853/31722

Enhanced heat transfer in electronic hardware by direct, small-scale actuation is investigated experimentally in two test bed configurations. The first configuration exploits the unsteady motions induced by a vibrating reed embedded within a heated duct (in contact with hardware that needs cooling) to enhance forced convection transport heat from the duct surfaces. The flow within the duct is either exclusively driven by the reed or, for higher heat flux, is augmented by an induced core flow. The time harmonic motion of the reed results in the regular shedding of vortical structures that interact with the inner surfaces in the absence and presence of a core flow. The second configuration focuses on the effects of small scale motions induced by a synthetic jet on heat transfer within an advanced heat sink. The synthetic jets emanate directly through the base of the heat sink and induce a recirculating flow between the fins, resulting in a lower thermal resistance than what is typically achieved with traditional fans. The unsteady flow characteristics in both configurations are investigated using particle image velocimetry (PIV). Of particular interest are the effects of small-scale motions and enhanced mixing on heat transfer compared to conventional time-invariant flows at similar or higher Reynolds numbers.