Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses

Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses

Bibliographic Details
Main Author: Maguire, Dawn Laurel
Published: Georgia Institute of Technology 2009
Subjects:
Strength of materials
Materials Fatigue
Online Access:http://hdl.handle.net/1853/30523
id ndltd-GATECH-oai-smartech.gatech.edu-1853-30523
record_format oai_dc
spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-305232013-12-15T03:44:22ZFailure mechanisms in VLSI bonds subjected to mechanical and environmental stressesMaguire, Dawn LaurelStrength of materialsMaterials FatigueGeorgia Institute of Technology2009-10-15T11:35:29Z2009-10-15T11:35:29Z1986-05Thesis297727http://hdl.handle.net/1853/30523
collection NDLTD
sources NDLTD
topic Strength of materials
Materials Fatigue
spellingShingle Strength of materials
Materials Fatigue
Maguire, Dawn Laurel
Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
author Maguire, Dawn Laurel
author_facet Maguire, Dawn Laurel
author_sort Maguire, Dawn Laurel
title Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
title_short Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
title_full Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
title_fullStr Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
title_full_unstemmed Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses
title_sort failure mechanisms in vlsi bonds subjected to mechanical and environmental stresses
publisher Georgia Institute of Technology
publishDate 2009
url http://hdl.handle.net/1853/30523
work_keys_str_mv AT maguiredawnlaurel failuremechanismsinvlsibondssubjectedtomechanicalandenvironmentalstresses
_version_ 1716620016894345216

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