Experimentally validated multiscale thermal modeling of electronic cabinets
Thermal characterization of electronic cabinets is becoming increasingly important, due to growing power dissipation and compact packaging. Usually, multiple length scales of interest and modes of heat transfer are simultaneously present. A steady reduced order thermal modeling framework for elect...
Main Author: | Nie, Qihong |
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Published: |
Georgia Institute of Technology
2009
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Subjects: | |
Online Access: | http://hdl.handle.net/1853/26492 |
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