Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems

Microelectronic systems such as cell phones, computers, consumer electronics, and implantable medical devices consist of subsystems which in turn consist of other subsystems and components. When such systems are designed, fabricated, assembled, and tested, they need to meet reliability, cost, perfo...

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Main Author: Kim, Injoong
Published: Georgia Institute of Technology 2008
Subjects:
Online Access:http://hdl.handle.net/1853/22708
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spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-227082013-01-07T20:26:11ZDevelopment of a knowledge model for the computer-aided design for reliability of electronic packaging systemsKim, InjoongSystem reliabilityKnowledge modelElectronic packaging systemsDesign-for-reliabilityElectronic packagingReliability (Engineering)Mathematical modelsMicroelectronic systems such as cell phones, computers, consumer electronics, and implantable medical devices consist of subsystems which in turn consist of other subsystems and components. When such systems are designed, fabricated, assembled, and tested, they need to meet reliability, cost, performance, and other targets for being competitive. The design of reliable electronic packaging systems in a systematic and timely manner requires a consistent and unified method for allocating, predicting, and assessing reliability and for recommending design changes at the component and system level with consideration of both random and wearout failures. Accordingly, this dissertation presents a new unified knowledge modeling method for System Design for Reliability (SDfR) called the Reliability Object Model (ROM) method. The ROM method consistently addresses both reliability allocation and assessment for systems composed of series and parallel subsystems. The effectiveness of the ROM method has been demonstrated for allocating, predicting, and assessing reliability, and the results show that ROM is more effective compared to existing methods, providing richer semantics, unified techniques, and improved SDfR quality. Furthermore, this dissertation develops representative reliability metrics for random and wearout failures, and incorporates such metrics into ROM together with representative algorithms for allocation, assessment, and design change recommendations. Finally, this research implemented the ROM method in a computing framework and demonstrated its applicability using several relevant microelectronic system test cases and prototype SDfR tools.Georgia Institute of Technology2008-06-10T20:47:14Z2008-06-10T20:47:14Z2007-12-19Dissertationhttp://hdl.handle.net/1853/22708
collection NDLTD
sources NDLTD
topic System reliability
Knowledge model
Electronic packaging systems
Design-for-reliability
Electronic packaging
Reliability (Engineering)
Mathematical models
spellingShingle System reliability
Knowledge model
Electronic packaging systems
Design-for-reliability
Electronic packaging
Reliability (Engineering)
Mathematical models
Kim, Injoong
Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
description Microelectronic systems such as cell phones, computers, consumer electronics, and implantable medical devices consist of subsystems which in turn consist of other subsystems and components. When such systems are designed, fabricated, assembled, and tested, they need to meet reliability, cost, performance, and other targets for being competitive. The design of reliable electronic packaging systems in a systematic and timely manner requires a consistent and unified method for allocating, predicting, and assessing reliability and for recommending design changes at the component and system level with consideration of both random and wearout failures. Accordingly, this dissertation presents a new unified knowledge modeling method for System Design for Reliability (SDfR) called the Reliability Object Model (ROM) method. The ROM method consistently addresses both reliability allocation and assessment for systems composed of series and parallel subsystems. The effectiveness of the ROM method has been demonstrated for allocating, predicting, and assessing reliability, and the results show that ROM is more effective compared to existing methods, providing richer semantics, unified techniques, and improved SDfR quality. Furthermore, this dissertation develops representative reliability metrics for random and wearout failures, and incorporates such metrics into ROM together with representative algorithms for allocation, assessment, and design change recommendations. Finally, this research implemented the ROM method in a computing framework and demonstrated its applicability using several relevant microelectronic system test cases and prototype SDfR tools.
author Kim, Injoong
author_facet Kim, Injoong
author_sort Kim, Injoong
title Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
title_short Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
title_full Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
title_fullStr Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
title_full_unstemmed Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
title_sort development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
publisher Georgia Institute of Technology
publishDate 2008
url http://hdl.handle.net/1853/22708
work_keys_str_mv AT kiminjoong developmentofaknowledgemodelforthecomputeraideddesignforreliabilityofelectronicpackagingsystems
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