Thermo-mechanical reliability of the VSPA package solder joints

Thermo-mechanical reliability of the VSPA package solder joints

Bibliographic Details
Main Author: Murphy, R. Sean
Published: Georgia Institute of Technology 2007
Subjects:
Solder and soldering Testing
Electronic packaging Reliability
Electronic packaging Testing
Online Access:http://hdl.handle.net/1853/17119

Internet

http://hdl.handle.net/1853/17119

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