A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys

Bibliographic Details
Main Author: Tundermann, John Hayes
Published: Georgia Institute of Technology 2007
Subjects:
Online Access:http://hdl.handle.net/1853/17087
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spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-170872013-12-15T03:35:51ZA study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloysTundermann, John HayesMetals Heat treatmentAlloys TestingGeorgia Institute of Technology2007-11-01T13:22:05Z2007-11-01T13:22:05Z1964-12Thesishttp://hdl.handle.net/1853/17087106539Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Metals Heat treatment
Alloys Testing
spellingShingle Metals Heat treatment
Alloys Testing
Tundermann, John Hayes
A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
author Tundermann, John Hayes
author_facet Tundermann, John Hayes
author_sort Tundermann, John Hayes
title A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
title_short A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
title_full A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
title_fullStr A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
title_full_unstemmed A study of the effects of temperature on the dihedral angles and interface energies of some ternary Al-Sn-Cu, Sb, Li, Mg, and In alloys
title_sort study of the effects of temperature on the dihedral angles and interface energies of some ternary al-sn-cu, sb, li, mg, and in alloys
publisher Georgia Institute of Technology
publishDate 2007
url http://hdl.handle.net/1853/17087
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